재료/제품

INNOVATION THROUGH CONSILIENCE

유기물반도체 박막 기판 (OTFT)

유기물반도체 박막 기판 (OTFT) 장점

Category a-Si on Glass LTPS on Plastic OTFT on Film
Process Temp. 300 °C 250 °C 100 °C
Process CVD, Dry Etcher, PVD
Sheet by Sheet process		 CVD, Dry Etcher, PVD
Sheet by Sheet process		 Wet(Liquid) coating and development
Roll to Roll process
No. of Mask 4~5 7~11 4~5
Mobility 0.1 ~ 1.0 cm2/Vsec 20 ~ 100 cm2/Vsec 0.5 ~ 4 cm2/Vsec
Off Current(A) >10-12 10-14~10-12 >10-14
Substrate Glass Soluble PI PET, PEN, PI, Poly-ketone, PC etc

  • a-Si TFT

  • LTPS

  • OTFT

유기물반도체 박막 기판 (OTFT) 공정 프로세스

OTFT Stacking Structure
Detail Process Surface Treatment S/D Electrode OSC Gate Insulator Gate Electrode Inter layer Dielectric Cathode Electrode
Organic material Coating Spin ○ ○ ○ ○
Slot Die / Inkjet ○ ○ ○ ○
PR Coating Spin ○ ○ ○ ○ ○ ○
Slot Die ○ ○ ○ ○ ○ ○
DFR ○ ○ ○ ○ ○ ○
Electrode Vacuum Deposition ○ ○ ○
Electroless Plating ○ ○ ○

유기물반도체 박막 기판 (OTFT) 공정 프로세스 장점

// Conventional Photolithography Process (One Layer)

// CLAP’s Organic TFT Process (One Layer)

특/장점
ㆍEliminate 3 Step (PR Coating, Etching, Strip)
ㆍNo need to use photoresist
ㆍCrosslink된 물질이 후속 공정에 의한 영향 없음

유기물반도체 박막 기판 (OTFT) Flatform

유기물반도체 박막 기판 (OTFT) 개발 Roadmap