재료/제품

INNOVATION THROUGH CONSILIENCE

유기물반도체 재료 (OSC)

핵심역량 : 유무기 재료 합성

Organic Thin Film Transistor InkSet

Formulation Selection Guideline

코팅공정, 트랜지스터 소자 성능 및 응용에 따라 다양한 유기 반도체 재료 선정

Formulation Coating Method Mobility
Spin Slot-die Inkjet Gravure
CP3100 0.5 ~ 1.0
CP4100 0.3 ~ 0.6
CP5100 ~ 4.0
CN5100 ~ 0.5
  • Planarization layer

    Planarization Layer A5XXX

  • Semiconductors p-types

    CP3100 Series
    ㆍEnable aSi replacement
    ㆍMobility up to 1㎠/Vs

    CP4100 Series
    ㆍMobility up to 1㎠/Vs
    ㆍCross-linkable semiconductor

    CP5100 Series
    ㆍMobility up to 4㎠/Vs

  • Semiconductors n-types

    CN5000 Series
    ㆍMobility up to 1.5㎠/Vs

  • Dielectrics

    CD2200 Series
    ㆍThermally cross linking dielectric

    CD7100 Series
    ㆍUV photopatternable dielectric

  • Ink Sets

    Inkset C1000SP
    ㆍBased on CP3100
    ㆍOptimized for spin coating

    Inkset C2000SL
    ㆍBased on CP5100
    ㆍOptimized for slot die or blade coating of OSC

    Inkset C3000S
    ㆍInkset for Metal Layer

  • Applications

    X-Ray Detector Fingerprint Sensor

    X-Ray Detector

    Display Backplanes OLED, Micro-LED

CP3100 Formulation Series

ㆍ다양한 코팅방식에 적합한 유기 p-type 반도체 재료
ㆍ균일한 소자 특성과 우수한 대기 안정성 보유
ㆍNon-halogenated 용매를 이용한 잉크 조액
ㆍBottom-gate와 Top-gate 트랜지스터 구조에 적합하게 적용 가능
ㆍ이동도 0.5~1 cm2/Vs
ㆍOn/Off ratio > 106
ㆍa-Si 소자 성능을 저가 기재에서 구현 가능

Method Viscosity(mPas) Availability Applications
Spin-coating 1.0 – 2.0 EPD, LCD
(display backplane)
Logic Circuits, Sensors
(in logistics, packaging, …)
Slot-die coating 1.0 – 8.0
Inkjet printing
Gravure printing
Stripe coating 0.5 – 3.0
Flexographic printing

CN5100 Formulation Series

ㆍ유기 반도체 조액과 소자의 우수한 공기 안정성 보유
ㆍNon-halogenated 용매를 이용한 잉크 조액
ㆍBottom-gate와 Top-gate 트랜지스터 구조에 적합하게 적용 가능
ㆍ이동도 ~0.5 cm2/Vs
ㆍPET 기재에 모든 공정이 가능

Method Viscosity(mPas) Availability Applications
Spin-coating 0.5 – 1.5 EPD, LCD
(display backplane)
Logic Circuits, Sensors
(in logistics, packaging, …)
Slot-die coating 1.0 – 8.0
Inkjet printing
Stripe coating 0.5 – 3.0