INNOVATION THROUGH CONSILIENCE
Selection of various organic semiconductor materials according to coating process, transistor device performance and application
Formulation | Coating Method | Mobility | |||
---|---|---|---|---|---|
Spin | Slot-die | Inkjet | Gravure | ||
CP3100 | ● | ● | ● | ● | 0.5 ~ 1.0 |
CP4100 | ● | ● | ● | ● | 0.3 ~ 0.6 |
CP5100 | ● | ~ 4.0 | |||
CN5100 | ● | ● | ● | ● | ~ 0.5 |
Planarization Layer A5XXX
CP3100 Series
ㆍEnable aSi replacement
ㆍMobility up to 1㎠/Vs
CP4100 Series
ㆍMobility up to 1㎠/Vs
ㆍCross-linkable semiconductor
CP5100 Series
ㆍMobility up to 4㎠/Vs
CN5000 Series
ㆍMobility up to 1.5㎠/Vs
CD2200 Series
ㆍThermally cross linking dielectric
CD7100 Series
ㆍUV photopatternable dielectric
Inkset C1000SP
ㆍBased on CP3100
ㆍOptimized for spin coating
Inkset C2000SL
ㆍBased on CP5100
ㆍOptimized for slot die or blade coating of OSC
Inkset C3000S
ㆍInkset for Metal Layer
X-Ray Detector Fingerprint Sensor
X-Ray Detector
Display Backplanes OLED, Micro-LED
ㆍp-type Organic semiconductor material suitable for various coating methods
ㆍPossessing uniform device characteristics and excellent atmospheric stability
ㆍManufacturing ink by using non-halogenated solvent
ㆍApplicable to bottom-gate and top-gate transistor structures
ㆍMobility 0.5~1 cm2/Vs
ㆍOn/Off ratio > 106
ㆍa-Si device performance can be realized at low cost
Method | Viscosity(mPas) | Availability | Applications |
---|---|---|---|
Spin-coating | 1.0 – 2.0 | ● |
EPD, LCD (display backplane) Logic Circuits, Sensors (in logistics, packaging, …) |
Slot-die coating | 1.0 – 8.0 | ● | |
Inkjet printing | ● | ||
Gravure printing | ● | ||
Stripe coating | 0.5 – 3.0 | ● | |
Flexographic printing | ● |
ㆍManufacturing liquid of organic semiconductors and having excellent air stability
ㆍManufacturing ink by using non-halogenated solvent
ㆍApplicable to bottom-gate and top-gate transistor structures
ㆍMobility ~0.5 cm2/Vs
ㆍAll processes are available on PET materials
Method | Viscosity(mPas) | Availability | Applications |
---|---|---|---|
Spin-coating | 0.5 – 1.5 | ● |
EPD, LCD (display backplane) Logic Circuits, Sensors (in logistics, packaging, …) |
Slot-die coating | 1.0 – 8.0 | ● | |
Inkjet printing | ● | ||
Stripe coating | 0.5 – 3.0 | ● |